Via (electronics)

Different types of vias (1 through hole, 2 blind via, 3 buried via)

In printed circuit board design, via refers to a pad with a plated hole that connects copper tracks from one layer of the board to other layer(s). The holes are electroplated, filled with annular rings, or small rivets are inserted. High-density multi-layer PCBs may have microvias: so-called blind vias, which are visible only on one surface, or buried vias, which are visible on neither. "Thermal vias" carry heat away from power devices. They are typically used in arrays of about a dozen vias.

In integrated circuit design, a via is a small opening in an insulating oxide layer that allows metallic interconnect on different interconnect layers to form a connection. A via on an integrated circuit is often called a through-chip via.

See also

The WikibookTranswiki:PCB layout guidelines has a page on the topic of

PCB layout guidelines

• Plated
• Through-hole technology

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