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ETX, standing for Embedded Technology eXtended, is a highly integrated and compact (3.7 x 4.9 in.) (95 x 125 mm) computer-on-module (COM) form factor that can be used in a design application much like an integrated circuit component. Each ETX COM integrates core CPU and memory functionality, the common I/O of a PC/AT (serial, parallel, etc.), USB, audio, graphics, and Ethernet. All I/O signals as well as a full implementation of ISA and PCI buses are mapped to four high density, low profile connectors on the bottom side of the module. ETX boards are available with AMD Geode, VIA, Intel Pentium, Celeron and Core Duo processors. XTXTM offers an 75% pin-compatible upgrade path to ETX standard. XTX drops the ISA bus and adds PCI-Express, SATA, and LPC. COM Express is a new COM standard. It is also known by the name "ETXexpress"; somewhat confusing because this standard has actually nothing to do with the ETX standard. Kontron Embedded Modules is a founding member of the ETX Industrial Group (ETX-IG). ETX and ETXexpress are trademarks or registered trademarks of Kontron Embedded Modules GmbH. Evolution of the ETX StandardOne of the fastest-growing concepts in the embedded world is the "Computer-On-Module" or COM. One of the principal COM implementations available in the market is the Embedded Technology eXtended (ETX) specification, first developed by Kontron (formerly *JUMPtec) in the early 2000. As technology evolves, the ETX standard has undergone further development in scalability and performance. In April 2006, Kontron and the members of the ETX Industrial Group released the latest generation of the ETX 3.0 specification. The ETX Industrial Group (www.etx-ig.org) is an independent association of companies and individuals that work to exchange knowledge about ETX, communicate with users of the ETX world, monitor trends and ensure the ETX standard fulfills the market’s needs. Membership is open to companies all over the world who develop and produce ETX modules. Members of the ETX Industrial Group include Kontron Embedded Modules GmbH, Advantech, MSC Vertriebs GmbH, ADLINK Technology, Evalue Technology Inc., SECO Srl, Arbor Technology Corp., Axiomtek Co., Blue Chip Technology, AAEON Technology Inc., AEWIN Technologies Co., IBase, Honeywell – CMSS and American Portwell Technology. To obtain a copy of the ETX 3.02 specification, visit the ETX Industrial Group website http://www.etx-ig.org .
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